Our thermal analysis services include:

• Detailed (CFD) thermal analysis of packaging architectures
  • BGA, FPBGA, QFP, QFN, etc.
   
• Compare and contrast various thermal solutions
   

• Specification of heat sink solutions based on system application
   
• Analysis Capabilities
  • Chip level (based on chip power map)
  • Package level (package design)
  • Board level (component layout)
  • System level (system design)