Enabling Solutions - Excellence in Signal Integrity Since 1996
Home  |  About  |  Signal Integrity  |  Thermal Analysis  |  System-in-Package  |  BGA Co-Design  |  Tools  |  Customers



Stacked die



RF System-in-Package

System-in-Package

Enabling Solutions, Inc. has been providing layout design and electrical enhancement services for RF SiP and memory-based SiP to Silicon Valley startups as well as some of the largest IDM companies for over 6 years. Our engineers have years of experience in RF analysis and layout optimization. The majority of our designs are in high volume production with our customers.

SiP layout
  • Quick-turn Proto: From schematic to actual parts in ~30 days
     
  • Optimize for size, performance, and cost
     
  • Highly experienced in:
     
    • Wi-Fi SiPs
       
      • Bluetooth
         
      • 802.11a/b/g
         
      • For mobile and embedded applications
         
    • Stacked memory SiPs
       
      • For memory cards