We use 3D electromagnetic tools as well as measurements to create RLC/IBIS models. We can provide models as lumped or distributed models based on the frequency of application.

We have optimized for electrical performance lead frame designs for packages of the following sizes:

TQFP

• 5 x 5 mm to 20 x 20 mm body size
• 32 to 176 lead counts

PQFP

• 10 x 10 mm to 40 x 40 mm body size
• 44 to 304 lead counts

TSSOP

• 3 mm to 6.1 mm body size
• 8 to 80 lead counts

QFN

• 3 x 3 mm to 9 x 9 mm body size
• 12 to 64 I/O pins
• RLC models developed in a 64 by 64 matrix format at 2GHz and 4GHz

BGA

• 64 to 1156 ball counts
• 7 mm to 40 mm body sizes
• We are experienced in designing substrates for microprocessor and ASIC type packages with special emphasis on DDRI, DDRII, SerDes, and PLL applications.

We have a highly experienced team for characterization of Flip Chip and wirebond packages.