Our co-design services specialize in the following layout types:

Wirebond

• 4-Layer Laminates
• 2-Layer Laminates
   
• 1.27 mm ball pitch
• 1.0 mm ball pitch
   
• 3-row deep staggered die pad layout
   

Flip Chip

• 3-2-3 Buildup
• 2-2-2 Buildup
• 1-2-1 Buildup
   
• 1.0 mm ball pitch
• 0.8 mm ball pitch
   
• Full area array layout with over 4600 pads